Language
HSDPA
1

GSM Mode RF

  • Multilayer Chip Ceramic Inductor/SDCL Series
  • Wire Wound Chip Ceramic Inductor/SDWL-C Series
  • Multilayer Chip High Q Inductor/HQ Series
  • Chip NTC Thermistor/SDNT Series
2

TD-SDCMA RF

  • Multilayer Chip Ceramic Inductor/SDCL Series
  • Wire Wound Chip Ceramic Inductor/SDWL-C Series
  • Multilayer Chip High Q Inductor/HQ Series
  • Chip NTC Thermistor/SDNT Series
3

PMU

  • Multilayer Chip Ferrite Inductor/SDFL Series
  • Multilayer Chip Ferrite Bead/GZ&PZ&UPZ&HPZ Series
  • Wire Wound SMD Power Inductor/SWPA&SPH Series
  • Multilayer Chip Power Inductor/MPH Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
4

TD-SCDMA/ GSM Baseband

  • Multilayer Chip Ferrite Inductor/SDFL Series
  • Wire Wound Chip Ferrite Inductor/SDWL-FW Series
  • Multilayer Chip Ferrite Bead/GZ&SZ&PZ&UPZ &HZ&HPZ Series
5

SRAM

  • Multilayer Chip Ferrite Bead/GZ&SZ&PZ&UPZ&EPZ Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
6

FLASH

  • Multilayer Chip Ferrite Bead/GZ&SZ&PZ&UPZ&EPZ Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
7

EEPROM

  • Multilayer Chip Ferrite Bead/GZ&SZ&PZ&UPZ&EPZ Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
8

USB I/F

  • Wire Wound Chip Common Mode Choke Coil/SDCW Series
  • Multilayer Chip Varistor/SDV Series
  • Multilayer Chip Ferrite Bead/PZ&UPZ Series
9

Audio

  • Multilayer Chip Varistor/SDV Series
  • Multilayer Chip Ferrite Bead/PZ&UPZ Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
10

PCMCIA

  • Multilayer Chip Varistor/SDV Series
  • Multilayer Chip Ferrite Bead/PZ&UPZ Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
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